PCB Assembly, SMT and Mixed Technology

EDL runs separate, automated surface mount assembly lines supporting fast-turn prototypes and moderate-volume, moderate mix needs plus high volume, mass production requirements. Our productions lines are anchored by Juki and MYDATA automated surface mount equipment systems.

Features and Capabilities include:

CAD Import of All Placement Data
High Speed Production of Densely Populated PCB Assemblies
Fast Turn Prototype and Pre-Mass Production Builds, Kitted or Turnkey
Placement Rates Exceeding 12 Million Parts Per Month
BGA and Micro-BGA
Ultra-Small, Ultra-Thin Chip Placements including Fine Pitch CSPs and QFPs Plus Odd Form Parts
Package-On-Package (POP) Technology including Automated Flux Dispensing and Laser Sighting
Pemtron Color 3D Solder Paste Inspection system (SPI)
YESTech Automated Optical Inspection (AOI)
Phoenix X-Ray Inspection
Vitronics-Soltec XPM 10 Zone Reflow Ovens
Automated Aqueous Cleaning
BGA Semi-Automated Re-Work Station

Each of our experienced, highly skilled manufacturing personnel are certified to IPC Class 3 standards and can handle the most challenging soldering needs.