EDL is an American Manufacturing Company

Forefront of Technology

EDL is at the forefront of technology providing the latest in THT, SMT, BGA, μBGA, QFP, CSP, and POP (package on package) capability, in addition to mixed technology assemblies. Keeping on the forefront of component placement requirements, we offer surface mount placement down to .05 mil pitch, with a component range of 0402 metric to 33.5mm square components. To ensure the highest level of quality, we provide extensive BGA/Micro-BGA X-Ray and functional testing.

We offer the latest technological services to meet your most demanding requirements.

  • Contract design services (PCB layout, circuit design, DFMA)
  • POP (package on package), BGA, micro BGA- supported with X-Ray and rework stations
  • AOI system
  • Surface mount and Through-hole technology
  • Conformal coating
  • Leaded and lead-free processes
  • Box builds
  • Cable assemblies
  • MRP system
  • Supply chain management
  • Customer consigned inventory programs
  • Vendor qualification and review process
  • ISO 9001:2008 standard
  • IPC-A- 610E, class 2 and 3
  • J-STD-001E, IPC Certified Trainer (CIT) on staff

Testimonials

"I wanted to say thanks for over 10 years of fantastic service. It's rare to find an assembly company that can do prototyping and handle medium to large scale production. When I first started my company I was doing work on a small scale and now it's rare not to have a product in the cue for assembly. The level of service has not changed. I'm always impressed with the quality of the assembly. Rarely ever an issue, but if there is you are always on top of figuring a solution to the problem. Read more ...


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