EDL is an American Manufacturing Company

Forefront of Technology

EDL is at the forefront of technology providing the latest in THT, SMT, BGA, μBGA, QFP, CSP, and POP (package on package) capability, in addition to mixed technology assemblies. Keeping on the forefront of component placement requirements, we offer surface mount placement down to .05 mil pitch, with a component range of 0402 metric to 33.5mm square components. To ensure the highest level of quality, we provide extensive BGA/Micro-BGA X-Ray and functional testing.

We offer the latest technological services to meet your most demanding requirements.

  • Contract design services (PCB layout, circuit design, DFMA)
  • POP (package on package), BGA, micro BGA- supported with X-Ray and rework stations
  • AOI system
  • Surface mount and Through-hole technology
  • Conformal coating
  • Leaded and lead-free processes
  • Box builds
  • Cable assemblies
  • MRP system
  • Supply chain management
  • Customer consigned inventory programs
  • Vendor qualification and review process
  • ISO 9001:2008 standard
  • IPC-A- 610E, class 2 and 3
  • J-STD-001E, IPC Certified Trainer (CIT) on staff

Testimonials

"For over a decade I have relied on EDL to support a variety of projects, they have never let me down and typically exceed my expectations. The quality of their work, economical pricing, and willingness to work as a team has significantly contributed to the success of numerous projects."

Bill, P. E., Senior Engineer

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